Optically-Coupled Radiative Heatsink
The culminating achievement of our company’s mission—to create the world’s first optically cooled data center—is our Optically Coupled Radiative Heatsink.
This groundbreaking technology not only builds on our advanced ceramic cold plate design, but also incorporates a Super-Planckian thermal emitter which transforms heat energy deposited into the cold plate into coherent narrow-band thermal radiation. This precisely tuned thermal radiation is then transmitted through an optical coupling.
Using this light-guiding link allows our customers to route the heat energy from the hottest components, directing it through the back of the server, and collimating it into a rack-mounted cavity system, where the light is finally dispersed to the roof where it is emitted into the expanse of space.
Our radiative heatsink will be capable of delivering an astonishing 1MW of passive cooling power per rack—completely devoid of any electricity or power consumption. We envision this revolutionary product to be a game-changer, poised to confront the impending cooling crisis associated with future high-density processors. Moreover, it offers a genuinely green alternative to traditional cooling systems—an innovation that can genuinely change the world as we know it.
But this is just the beginning.
Maxwell Labs’ latest innovation takes our patented radiative heatsink technology a step further. Imagine a cooling system that doesn’t just reduce heat, but intelligently targets the specific areas that heat up the most. That’s where our active solid-state cooling comes in, working in conjunction with an embedded artificial intelligence (AI) system. This AI continuously monitors chip temperature and heat flow patterns in real-time, precisely directing the cooling effort to the hottest parts as and when they form. This ensures the chip always performs optimally, even under high workload conditions.
But our technology doesn’t stop at efficient cooling. It also cleverly recycles the very heat it dissipates. It captures the waste heat generated by the chip – typically lost energy – and converts it back into electricity. This recovered power is then stored for future use. In this way, we’re not only managing heat more effectively but also turning what was previously a problem into a solution – a source of energy.
The fusion of our intelligent energy recovery system with precise, solid-state radiative cooling paves the way for a new horizon in chip design. This unique integration empowers the industry to devise processors capable of operating at extraordinarily high power densities. These levels of operation would otherwise trigger temperatures far surpassing the physical limitations of today’s prevalent cooling systems, such as air, liquid, or immersion cooling.
With this breakthrough technology, we’re not just incrementally enhancing performance; we’re pushing the boundaries to the very edge of what is conceivable in the future of supercomputing systems. Imagine an era of computing where ultra-efficiency and low temperatures aren’t merely desirable qualities but are integral facets of design.
At Maxwell Labs, we’re doing more than envisioning this future—we’re actively creating it. Our products are meticulously crafted to redefine the computing industry’s trajectory, where sustainability and performance aren’t disparate objectives but harmonious partners. As we innovate, we strive to showcase that environmental responsibility and outstanding performance can, and should, walk hand in hand in the age of advanced computing.